Solder Fluxes: We have low solid content and high solid content fluxes available for various applications. Low solid content fluxes are generally cleaner, while high solid content fluxes are suitable where there is a need for good solderability. We also have fluxes that are newly developed for lead free soldering. Most of our fluxes are no-clean but we also provide water soluble fluxes as well.

Solder Pastes: There are a wide variety of solder pastes that Plaschem carries. Depending on your needs, we can recommend the most suitable solder paste for your process. The main considerations for determining a suitable product are:

  • Printability
  • Reliability
  • High Speed
  • Resistance to slump
  • Resistance to bridge/bead
  • Tack time
  • Wettability
  • Residue colour

We also have pastes that can ensure ICT testability. Lead free solder pastes have also been developed in preparation for the phasing out of products containing lead..

Micro-etching Chemistry: Mecbrite CB-800 is H2SO4-H202 type microetchant to treat a copper surface of a consumer board. Its advantages include – can be used by spray or immersion, no need of sulfuric acid post treatment to remove smuts, less COD and simple waste treatment. It can be used prior to the application of solder masks, pre-fluxes or MECSEALS and to also remove the soils and heavy rust caused by mist during nickel plating.

Organic Solderable Pre-Flux: Mecseal is the copper protective coating which prevents rusting and preserves solderability. Its advantages include having strong protection against rust, preserves stable soldering with high heat and humidity resistance. An excellent spreadability of solder paste is ensured, especially for low melting point solder. It is safer and more convenient for handling as compared to others.

 



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