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Solder
Fluxes:
We have
low solid content and high solid content fluxes available for various
applications. Low solid content fluxes are generally cleaner, while
high solid content fluxes are suitable where there is a need for
good solderability. We also have fluxes that are newly developed
for lead free soldering. Most of our fluxes are no-clean but we
also provide water soluble fluxes as well.
Solder
Pastes:
There
are a wide variety of solder pastes that Plaschem carries. Depending
on your needs, we can recommend the most suitable solder paste for
your process. The main considerations for determining a suitable
product are:
- Printability
- Reliability
- High
Speed
- Resistance
to slump
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- Resistance
to bridge/bead
- Tack
time
- Wettability
- Residue
colour
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We also have
pastes that can ensure ICT testability. Lead free solder pastes
have also been developed in preparation for the phasing out of products
containing lead..
Micro-etching
Chemistry:
Mecbrite
CB-800 is H2SO4-H202
type microetchant to treat a copper surface of a consumer board.
Its advantages include – can be used by spray or immersion,
no need of sulfuric acid post treatment to remove smuts, less COD
and simple waste treatment. It can be used prior to the application
of solder masks, pre-fluxes or MECSEALS and to also remove the soils
and heavy rust caused by mist during nickel plating.
Organic
Solderable Pre-Flux:
Mecseal
is the copper protective coating which prevents rusting and preserves
solderability. Its advantages include having strong protection against
rust, preserves stable soldering with high heat and humidity resistance.
An excellent spreadability of solder paste is ensured, especially
for low melting point solder. It is safer and more convenient for
handling as compared to others.

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