Acid Cleaner is excellent in deoxidising, cleaning and removal of inorganic/organic residue such as chromates, finger prints for the copper, non-ferrous heavy metal and stainless steel. Its features include economical environmentally safe disposal treatment and low foaming.

Half Etch Chemistry is H₂SO₄-H₂0₂ type microetchant used for treatment of copper surface of PCB. It can evenly microetch a copper foil in half-etch process and provide optimum result. Stable concentration of Hydrogen peroxide and easy control of etching amount are advantages.

Hot Air Levelling Flux is a water soluble organic type flux specially designed for use in the hot air leveling operation. Excellent heat resistance, producing brighter solder surface with excellent solderability, can offer uniformed solder thickness. Solder bridge and flux residues can be easily removed and with minimum solder spattering.