Ferric Chloride Etchant is a solution formulated specifically for the photochemical machining process. Used with the spraying etching equipment, it is compatible with the precision etching of Copper alloy, Nickel Alloy, Stainless Steel, other metals and alloys.

MecEtchBond Chemistry is an organic-acid based micro-etching chemical that enhances adhesion of resin to copper. Specially designed for fine line jobs in the printed circuit board industry, it offers stable etching speed and is easy to use.

Immersion Tin is a new surface finishing for printed circuit boards. Applicable for both vertical and horizontal lines, it is most suited for the fine pitch SMD technology where co-planarity requirement is critical. It offers an excellent alternative to conventional hot air leveling process as it compatible with no-clean flux.

Immersion Silver is a replacement for reflowed Tin Lead or HASL, particularly when soldering low pitch devices. Immersion Silver coating demonstrates the lowest contact resistance and superior conductivity.