Defoamers: Our defoamer is an efficient non-silicone based particularly used in dry film/ink stripping, photo-imageable solder mask developing and waste water treatment. Specifically formulated to resolve foam problem, its formulation is ideal for use in conveyorized spraying machines without adversely affecting the equipment.

SES Chemistry: The Strip Etch Strip Process comprises of the Plaschem Dry/Film Stripper, Plaschem Ammonia Etchants and MEC Tin Stripper S-1728X.

Plaschem Fully Aqueous Dry Film Stripper, free of any toxic glycol ether type solvents is an aqueous solution formulated for high-speed removal of all leading alkaline dry film photo resists. It will not activate or darken Tin surfaces, leaving copper surfaces bright and untarnished.

Plaschem Ammonium Etchant is an alkaline etching chemistry for the manufacturing of high quality printed-through-hole or print and etch type PCB. It has the feature of consistent high etching rate.

The advantages of the one step tin/lead stripper include fast stripping rate, simple waste treatment, no measling and less sludge. MEC’s Tin Stripper, which is non fluoride and non-peroxide is simple to handle and control.

PTH Chemistry: Plaschem plated through hole process provide medium build electroless copper and meet the IPC specification. The process is distinguished by its stability and ease of control over a wide range of operating conditions. Deposits are fine grained, dense and ductile, high-quality deposits for D/S and MLB manufacturing.